HDI PCB Design Guidelines
STRUCTURE SELECTION
01 / 1+N+1
ONE SEQUENTIAL LAYER
Optimized for high-density routing and fine-pitch BGAs. This structure provides reliable interconnects with minimal manufacturing complexity and lead time.
02 / 2+N+2
DOUBLE SEQUENTIAL LAYER
Designed for extreme routing density and complex multi-layer stack-ups. Ideal for aerospace, medical, and high-speed computing applications requiring maximum interconnect density.
RELIABILITY RULES
Among the essential HDI PCB design guidelines, optimizing microvia geometry for high-density interconnect reliability and manufacturability is a rule you must follow.
01
Microvia Diameter
Minimum: 4.0 mil
02
Target Pad Size
Minimum: 10.0 mil
03
Aspect Ratio
Maximum: 1.5:1
04
Dielectric Thickness
Minimum: 1.0 mil
05
Stacked Structures
Recommended: Staggered
STACK-UP PLANNING
Designing an HDI board requires a shift in perspective. Before routing begins, engineers must define the stack-up—layer counts, dielectric thicknesses, and copper distribution. This blueprint dictates impedance, routing density, and return paths, ensuring manufacturability from the first schematic.
