ENGINEER INQUIRY
Have a question? Talk to our HDI PCB engineers who understand how your board will actually be built. Send us the problem and we'll help you figure out the manufacturing side.
TECHNICAL FAQ
We answer your HDI PCB engineering questions
WHAT IS THE MINIMUM MICROVIA DIAMETER?
Our laser-drilling technology supports microvias as small as 4 mil in diameter, ensuring high-density interconnects for advanced designs.
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DO YOU SUPPORT STACKED MICROVIA STRUCTURES?
Yes, we support complex stacked microvia structures, though we recommend staggered configurations for improved reliability and manufacturability.
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WHAT IS THE MAXIMUM VIA ASPECT RATIO?
For optimal performance, we recommend a maximum aspect ratio of 3:1. Higher ratios can lead to increased resistance and potential reliability issues.
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WHAT MATERIALS DO YOU USE FOR HDI STACK-UPS?
We utilize high-performance FR-4, high-speed low-loss materials, and specialized dielectrics to ensure signal integrity in demanding aerospace and medical applications.
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DO YOU PROVIDE IMPEDANCE CONTROL SERVICES?
Yes, our engineering team provides comprehensive impedance review and stack-up development to ensure your high-speed digital systems meet precise requirements.
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