HDI PCB Capabilities

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Microvia Specifications

Drilling Precision

Minimum Diameter: 4 mil
Blind Microvias: 4-8 layers
Stacked Structures: 2-4 layers
Laser Drilling: 100% precision

Structural Density

Aspect Ratio: 1.5:1 max
Staggered Routing: 45° offset
Sequential Lamination: 3+ cycles
High-Density Interconnects

Reliability Metrics

Copper Filling: 100% coverage
Planarization: 100% surface
Via-in-Pad: 3.5 mil pad
High-Temperature Reliability

Sequential Lamination

Support for 1+N+1, 2+N+2, and complex multi-layer stack-ups
Optimized build structures for high-density interconnects
Sequential cycles balancing routing density and reliability
Advanced materials selection for demanding aerospace and medical applications

VIA-IN-PAD OPTIONS

Maximize routing density beneath fine-pitch BGAs with our advanced via-in-pad solutions. We provide precise laser-drilled structures that ensure reliable electrical connections and mechanical stability for complex high-density interconnects.

TECHNICAL SPECIFICATIONS

Minimum Via Diameter: 4.0 mil
Aspect Ratio: 1.0:1.0
Copper Filling: Full or Partial
Planarization: High-Precision
Escape Routing: Integrated Support

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PRECISION FEATURES

Trace / Space

HDI PCB capabilities for fine-line: 2.5/1.5/0.5 mil trace/space spec.

Impedance Control

± 10% Tolerance
Single-ended & Differential
Stack-up Engineering Review

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Certifications & Registrations

ITAR

ISO 13485:2016

ISO 9001:2015

NIST

RoHS

REACH

IPC-A-600 Class 3

AS9100D

MIL-PRF-31032

J-STD-001ES